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CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor Scanners at the European Mask and Lithography Conference
Minneapolis, Minnesota — May 14, 2018 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.
The conference brings together scientists, researchers, engineers and technologists from around the world to present innovations at the forefront of mask and wafer lithography. CyberOptics’ Allyn Jackson will discuss leveling, vibration and effective ways to monitor relative humidity (RH) in reticle scanner environments to reduce a phenomenon called “haze.”
“Whether for diagnostics, qualification or preventative maintenance, equipment engineers need to efficiently and effectively make measurements and adjustments to the tool. In reticle environments, these measurement methods are typically cumbersome, non-representative, not in real-time, can compromise the production environment and can lead to costly downtime,” said Allyn Jackson, Sr. Field Applications Engineer and Director of Sales for U.S. and Europe at CyberOptics. “By contrast, best practices involve collecting and displaying real-time acceleration, vibration and humidity data to significantly speed equipment set-up and alignment while reducing reticle haze.”
Solutions reviewed in the case study will include CyberOptics’s ReticleSense® Auto Multi Sensor that can travel throughout the entire reticle environment to wirelessly capture relative humidity (RH) measurements. The device can also measure vibration and leveling – all in real-time to improve yields and tool uptime.
About the WaferSense® and ReticleSense® Line
The WaferSense and ReticleSense measurement portfolio including the Auto Leveling System (ALS & ALSR), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors (APS 2, 3, APSR & APSRQ) and the Auto Multi Sensor (AMS & AMSR), are available in various wafer shaped and reticle shaped form factors depending on the device.
PRESS ROOM
